Advanced Micro Devices (AMD) is set to release Basic Input/Output System (BIOS) updates that increase performance for its Ryzen 9600X/9700X processors and disclose some latency issues.
The advancements in performance and latency reductions come around a month after disappointing Zen 5 desktop CPU reviews and appear along with updates to Windows 11 that include optimised AMD-specific branch prediction for both Zen 4 and Zen 5 chips.
It has been noticed that CPU reviewers reported a higher-than-expected core-to-core latency across the Ryzen 9000 series of desktop processors. Currently, AMD has informed this with a new BIOS optimisation.
The latest AMD updates for AM5 motherboards include AGESA PI 1.2.0.2 firmware, which AMD said to address some “corner cases” where it takes two transactions to read and write when information is shared across different parts of a Ryzen 9 9000 processor.
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AMD said: “We’ve managed to cut the number of transactions in half for this use case, which helps reduce core-to-core latency in multi-CCD models.”
Moreover, this BIOS update includes a new 105-watt cTDP option to push the thermal design power of the Ryzen 9600X and 9700X. “These processors have been validated at 105W since their release, so you won’t be pushing them beyond their design limits,” added AMD.
“This boost is especially beneficial for multithreaded workloads, but you might see some gains in less-threaded apps too.”
You would be required to ensure that you have appropriate cooling to turn on the 105-watt mode, while AMD said it should result in around 10% more performance on the Ryzen 9600X and 9700X.
In addition, AMD is set to launch its next round of AM5 motherboards soon, with the X870 and X870E boards both available at retailers. Meanwhile, you don’t need these new boards for AMD’s latest Ryzen 9000-series CPUs, but they arrive with USB 4.0 as standard.