Samsung has been improving the cooling system of its flagship phones, and the upcoming Galaxy S25 Ultra is set to continue this trend. Beginning with the Galaxy S23 Ultra, Samsung introduced a vapour chamber cooling system to improve heat dissipation.
The Galaxy S24 Ultra saw a bigger vapour chamber for better performance, and now, leaks suggest the Galaxy S25 Ultra will have an even larger one, making it 42% more efficient.
This new cooling system is expected to help the Galaxy S25 Ultra perform better during heavy use, such as gaming or extended tasks. By using a bigger vapour chamber, the device will be able to handle the heat generated by the powerful Snapdragon 8 Elite chip without throttling its performance.
Even the regular Galaxy S25 and S25 Plus models are rumoured to benefit from a 10% improvement in cooling, thanks to the larger vapour chamber.
The upgraded cooling system will not only enhance performance but also ensure that the phone doesn’t feel hot to the touch, a feature Samsung introduced with the S24 Ultra and may improve further in the S25.
This efficient cooling system will allow the Galaxy S25 lineup to sustain performance for longer periods, keeping the device running smoothly without overheating.
In addition to the cooling upgrade, the Galaxy S25 will feature Qualcomm’s Snapdragon 8 Elite chip, which is expected to boost the phone’s GPU by 34%, the CPU by 38%, and the NPU by 43%.