Tech Desk 
Dec 18, 2024
MediaTek is set to introduce next-generation Dimensity chipsets in China. Through the social media accounts, the company confirmed the launch of new chipsets, revealing their names.
MediaTek's rumoured Dimensity 8400 SoC is likely to debut at the launch event as the successor to last year's Dimensity 8300 SoC. The purported 4nm chip could use a 1+3+4 architecture. It is said to have scored more than 1.8 million points in AnTuTu benchmarks.
On Weibo, MediaTek revealed that its next-generation Dimensity chips will be launched on December 23 at 03:00pm (12:00pm IST). Howeover, the brand didn't revealed the exact moniker of the upcoming chipsets, while based on recent rumours, it’s expected one of them to be the Dimensity 8400 SoC.
MediaTek Dimensity 8400 specifications (expected)
MediaTek Dimensity 8400 SoC is manufactured using TSMC's 4nm technology and it is likely to have a 1+3+4 architecture.
The Dimensity 8400 SoC is teased to house a prime CPU core clocked at 3.25GHz, three cores capped at 3.0GHz and four cores capped at 2.1GHz. It is expected to rival Qualcomm's Snapdragon 8 Gen 3 chipset.
Original equipment manufacturers (OEMs) are expected to pack the Dimensity 8400 SoC in smartphones with an initial price tag of CNY 1,500 (approximately INR 17,250). The purported Redmi Turbo 4 is rumoured to be the first smartphone to debut with the Dimensity 8400 chipset.
Moreover, the rumoured Oppo Find X8S and Redmi K80E are anticipated to run on the rumoured MediaTek Dimensity 8400 chipset.
